SiS präsentiert Chipsatz für den Hammer

Erschienen: 18.11.2002, 06:30 Uhr, Quelle: Planet 3DNow!, Autor: Patrick von Brunn

SiS hat heute auf der Comdex in Las Vegas seinen Chipsatz für den Hammer von Entwickler AMD angekündigt. Der SiS755 wird neben neuen Technologien, wie zum Beispiel MuTIOL, auch alt bekannt wie AGP 8x, USB 2.0, AC´97 Sound und Ethernet unterstützen. Die MuTIOL Technologie beschleunigt den Datenaustausch zwischen North- und Southbridge. Mehr in der Pressemitteilung (Englisch)...

"TAIPEI, TAIWAN, Nov. 18, 2002 – Silicon Integrated Systems Corp. (SiS), a leading supplier of core logic and graphics chipsets, today unveiled the SiS755 to support the AMD® Hammer processor platform. The SiS755 is compliant with all AMD® Hammer processors with HyperTransport™ interface and supports AGP 8X and MuTIOL® 1G technology.

The SiS755 provides a fast, powerful and affordable solution for the high-end performance computing market. Paired with the SiS963, a South Bridge peripheral interface, the SiS755 is loaded with powerful multimedia functions, including 5.1 Channel AC´97 2.2 Audio, 10/100Mb Ethernet, Home PNA2.0 and Dual ATA133/100/66 IDE Channels. The SiS755 supports six PCI slots and six USB 2.0/1.1 ports.

“The SiS755 is another example of SiS’ commitment to getting to market first with new technologies and products for our customers and to supporting both the Intel® and AMD® platforms,” said Michael Chen, senior vice president, Integrated Product Division, SiS.

The SiS755/SiS963 combination utilizes MuTIOL® 1G technology to provide a fast and seamless connection between the North and South Bridge. The MuTIOL® 1G is a SiS proprietary data bandwidth transfer technology with 1GB/sec transfer speed and bi-directional 16-bit data bus at 533MHz operating speed.

To further ensure maximum bandwidth and transfer speeds, the SiS755 integrates high-performance HyperTransport™ compliant bus driver and technology with 8/16 links support to achieve a transfer bandwidth of up to 6.4GB/sec..."

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